Title:
SILICONE RESIN COMPOSITION PRODUCTION METHOD AND SILICONE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/189789
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a silicone resin composition production method with which a high-quality cured object can be produced with ease, and a silicone resin composition. The present invention pertains to a silicone resin composition production method comprising the step of stirring a mixture of a silicone resin A and a silicone resin B until the formula (A) is satisfied.
(A) 1.03 < Mwcom/Mwab < 1.2
(Mwab is the weight average molecular weight of the mixture of the silicone resin A and the silicone resin B, and Mwcom is the weight average molecular weight of the product obtained through the stirring step.)
Silicone resin A: silicone resin which contains structural units essentially consisting of T units, in which a T3 unit constitutes 60 mol% to 90 mol% of the T units, and which has a weight average molecular weight of 1500-8000.
Silicone resin B: silicone resin which contains structural units essentially consisting of T units, in which a T3 unit constitutes 30 mol% (inclusive) to 60 mol%(exclusive) of the T units, and which has a weight average molecular weight of 1500 or more.
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Inventors:
IWAWAKI HIROSHI (JP)
HOTTA SHOHEI (JP)
MASUI KENTARO (JP)
HOTTA SHOHEI (JP)
MASUI KENTARO (JP)
Application Number:
PCT/JP2019/014071
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L83/04; C08J99/00
Domestic Patent References:
| WO2017110621A1 | 2017-06-29 |
Foreign References:
| JP2016180050A | 2016-10-13 | |||
| JP2018028042A | 2018-02-22 | |||
| JP2007119569A | 2007-05-17 | |||
| JP2007270004A | 2007-10-18 | |||
| JP2007031565A | 2007-02-08 | |||
| JP2007177207A | 2007-07-12 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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