Title:
SILICONE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/281845
Kind Code:
A1
Abstract:
Provided is a silicone resin composition which exhibits excellent workability and which maintains fluidity even if filled, to a high degree, with a thermally conductive filler. This silicone resin composition contains: a component (A), an organopolysiloxane which is represented by a formula (1) and has a molecular weight distribution (Mw/Mn) of 1.20 or less; and a component (B), a thermally conductive filler. In the formula (1), R1 moieties are each independently a monovalent saturated hydrocarbon group or a monovalent aromatic hydrocarbon group, R2 is a monovalent saturated hydrocarbon group, X is oxygen or a divalent hydrocarbon group, n is an integer of 1 or more, and a is an integer between 1 and 3.
Inventors:
KANNO YUUTO (JP)
DEYAMA YOSHIHIRO (JP)
TANAKA SHUGO (JP)
DEYAMA YOSHIHIRO (JP)
TANAKA SHUGO (JP)
Application Number:
PCT/JP2022/012937
Publication Date:
January 12, 2023
Filing Date:
March 22, 2022
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08L83/06; C08K3/013
Domestic Patent References:
| WO2015155948A1 | 2015-10-15 |
Foreign References:
| JP2020158631A | 2020-10-01 | |||
| JP2016084378A | 2016-05-19 | |||
| JP2020164756A | 2020-10-08 | |||
| JP2022075003A | 2022-05-18 | |||
| JP2005054099A | 2005-03-03 | |||
| JP2004091743A | 2004-03-25 | |||
| JP2000063873A | 2000-02-29 |
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