Title:
SILICONE RESIN MATERIAL FOR INJECTION MOLDING MOLD AND INJECTION MOLDING MOLD
Document Type and Number:
WIPO Patent Application WO/2020/116135
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a silicone resin material for an injection molding mold and a molding mold for injection molding that is made of the silicone resin material for an injection molding mold, with which it is possible to reduce deformation caused by a filling pressure and a heating temperature during injection molding, improve the production efficiency of an injection molded article, and prevent breakage caused by thermal expansion during injection molding in a molding mold for injection molding that uses a silicone resin as a base material. The silicone resin material for an injection molding mold is characterized in that each of hardness, tensile strength, and tear strength of the silicone resin material for an injection molding mold satisfies a value greater than or equal to a prescribed lower limit, and that thermal conductivity thereof satisfies a value greater than or equal to a prescribed lower limit.
Inventors:
FURUKAWA MASASHI (JP)
FURUKAWA MASAKAZU (JP)
SUZUKI YUSUKE (JP)
HAYAKAWA AKINOBU (JP)
FURUKAWA MASAKAZU (JP)
SUZUKI YUSUKE (JP)
HAYAKAWA AKINOBU (JP)
Application Number:
PCT/JP2019/044988
Publication Date:
June 11, 2020
Filing Date:
November 18, 2019
Export Citation:
Assignee:
WACKER ASAHIKASEI SILICONE CO LTD (JP)
SATSUMA SOKEN CO LTD (JP)
SATSUMA SOKEN CO LTD (JP)
International Classes:
B29C33/40
Domestic Patent References:
| WO2014141529A1 | 2014-09-18 |
Foreign References:
| JP2001315134A | 2001-11-13 | |||
| JPS6364706A | 1988-03-23 |
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