Title:
SILICONE RUBBER-SILICONE MODIFIED POLYIMIDE RESIN LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2019/189542
Kind Code:
A1
Abstract:
Since this laminated body having a silicone rubber and, at least in a section of a surface thereof, a layer of a cured product of a silicone-modified-polyimide resin composition that contains, for example, components (A), (Bc), and (C) possesses elasticity and allows wiring by means of a conductive paste thereon, such a laminated body is suitable as a base material of an electronic device. The component (A) is a silicone-modified polyimide resin in formula (1) Ee-Ff-Gg (1) {where E is represented by formula (2); F is represented by formula (3); G is a bivalent group derived from a diamine; f + e + g = 100 mol%; the molar ratio f/(e + g) is 0.9 to 1.1; and e is 1-90 assuming that the sum of e and g is 100 (RA is a bivalent hydrocarbon group, R1 and R2 are alkyl groups, R3 and R4 are monovalent aliphatic hydrocarbon groups, R5 and R6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m + n + o is an integer of 1-30) -Im-X-Im- (3) (Im is a cyclic group containing a cyclic imide structure, and X is selected from a single bond, O, and so forth)}; the component (Bc) is a thermally degradable radical initiator; and the component (C) is a solvent.
Inventors:
HATTORI HATSUHIKO (JP)
Application Number:
PCT/JP2019/013506
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
B32B27/00; B32B27/34; C08F299/02; C08G77/455
Domestic Patent References:
| WO2017110576A1 | 2017-06-29 | |||
| WO2011089922A1 | 2011-07-28 |
Foreign References:
| JP2017222745A | 2017-12-21 | |||
| JP2005347273A | 2005-12-15 | |||
| JPH10279799A | 1998-10-20 | |||
| JP2003055636A | 2003-02-26 | |||
| JPH05125337A | 1993-05-21 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Download PDF:
Previous Patent: RESIN SHEET, METHOD FOR USING RESIN SHEET, AND METHOD FOR PRODUCING CURED SEALING BODY WITH CURED RE...
Next Patent: POWER MODULE
Next Patent: POWER MODULE