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Title:
SILOXANE RESIN REMOVER, SILOXANE RESIN REMOVAL METHOD USING SILOXANE RESIN REMOVER, SEMICONDUCTOR SUBSTRATE PRODUCT AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/092022
Kind Code:
A1
Abstract:
This remover for removing siloxane resin attached to a semiconductor substrate contains a polar aprotic solvent and a quaternary ammonium hydroxide.

Inventors:
SUGISHIMA YASUO (JP)
MIZUTANI ATSUSHI (JP)
Application Number:
PCT/JP2013/082861
Publication Date:
June 19, 2014
Filing Date:
December 06, 2013
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/304; C09J5/00; C09J163/00; C09J183/04; C11D3/20; C11D3/26; C11D3/43; C11D7/26; C11D7/32; C11D7/50
Foreign References:
JP2004177669A2004-06-24
JP2003114540A2003-04-18
JPH0728254A1995-01-31
JP2012060050A2012-03-22
JP2002038197A2002-02-06
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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