Title:
SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET, EACH OF WHICH USES SAID SILVER-COATED COPPER POWDER
Document Type and Number:
WIPO Patent Application WO/2016/038914
Kind Code:
A1
Abstract:
Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like.
A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 μm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 μm as determined by a laser diffraction/scattering particle size distribution measuring method.
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Inventors:
OKADA HIROSHI (JP)
YAMASHITA HIDEYUKI (JP)
YAMASHITA HIDEYUKI (JP)
Application Number:
PCT/JP2015/059485
Publication Date:
March 17, 2016
Filing Date:
March 26, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B22F1/052; B22F1/06; B22F1/068; B22F1/10; B22F1/103; B22F1/17; C09C1/02; C09C3/06; C09D5/24; C09D201/00; C23C18/42; C25C5/02; H01B1/00; H01B1/22; H01B5/00
Foreign References:
| JP2013053347A | 2013-03-21 | |||
| JP2013100592A | 2013-05-23 | |||
| JP5503813B1 | 2014-05-28 | |||
| JP2011214032A | 2011-10-27 |
Other References:
See also references of EP 3192597A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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