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Title:
SILVER-COATED FLAKE-FORM COPPER POWDER, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/044676
Kind Code:
A1
Abstract:
In the present invention, the value of a brightness L* with respect to a degree of dispersion defined by D90/D10 is 13 or higher, where D90 is the volume-cumulative grain diameter at an accumulated volume of 90 vol% according to a laser-diffraction-scattering grain distribution measurement method, and D10 is the volume-cumulative grain diameter at an accumulated volume of 10 vol%. A silver-coated flake-form copper powder is manufactured by a method in which: a dispersion liquid containing a copper parent powder and a first complexing agent is processed by a medium-stirring mill device, and copper parent particles constituting the copper parent powder are deformed into a flaky form; and the copper parent powder, which includes the copper parent particles that were deformed into a flaky form, is processed by an aqueous liquid containing silver ions and a second complexing agent, and the silver is deposited onto the surface of the copper parent particles.

Inventors:
FUJIMOTO TAKU (JP)
Application Number:
PCT/JP2021/027964
Publication Date:
March 03, 2022
Filing Date:
July 28, 2021
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
B22F1/00; B22F9/04; C23C18/31; C23C18/42; C25C5/02; H01B5/00
Domestic Patent References:
WO2007040195A12007-04-12
Foreign References:
JP2015071819A2015-04-16
JP2008533307A2008-08-21
JP2014116315A2014-06-26
JP2010275638A2010-12-09
JP2010275638A2010-12-09
JP2015071818A2015-04-16
JP2016035098A2016-03-17
Other References:
See also references of EP 4205886A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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