Title:
SILVER-CONTAINING PASTE, AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2022/113923
Kind Code:
A1
Abstract:
This silver-containing paste is used for bonding a silicon surface of a silicon chip to a metal surface, and contains silver-containing particles, a difunctional or higher resin, and a solvent. The content of the silver-containing particles (A) is 88-98 mass% relative to 100 mass% of the silver-containing paste excluding an organic solvent (C).
Inventors:
WATANABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2021/042727
Publication Date:
June 02, 2022
Filing Date:
November 22, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09J4/02; C09J11/04; C09J11/06; C09J163/00; H01L21/52
Domestic Patent References:
| WO2020189445A1 | 2020-09-24 | |||
| WO2017073393A1 | 2017-05-04 |
Foreign References:
| JP2017171844A | 2017-09-28 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: