Title:
SILVER MICROPARTICLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/189846
Kind Code:
A1
Abstract:
Provided is a silver microparticle composition containing silver microparticles, an amine, and a dithiol, wherein the average particle diameter of the silver microparticles is 40 nm to 100 nm, the volume percentage of silver microparticles having a particle diameter of 100 nm or less to the total amount of silver microparticles is 5% to 25%, and the volume percentage of silver microparticles having a particle diameter exceeding 500 nm to the total amount of silver microparticles is 10% to 60%.
Inventors:
MATSUI MIKI (JP)
NAKAJIMA NAOYA (JP)
NAKAJIMA NAOYA (JP)
Application Number:
PCT/JP2023/010983
Publication Date:
October 05, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
B22F9/24; B22F1/00; B22F1/102; H01B1/22
Domestic Patent References:
| WO2022009754A1 | 2022-01-13 | |||
| WO2018190397A1 | 2018-10-18 |
Foreign References:
| JP2019087396A | 2019-06-06 | |||
| JP2021098890A | 2021-07-01 |
Attorney, Agent or Firm:
SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)
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