Title:
SILVER MICROPARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/189993
Kind Code:
A1
Abstract:
Provided are silver microparticles that exhibit a large volumetric shrinkage and a high conductivity. The particle size of the silver microparticles as measured by BET method is 0.1-1 μm. The volume resistivity and volumetric shrinkage ratio of the silver microparticles after being fired in the form of pellets at a temperature of 100°C for 1 hour in a nitrogen atmosphere are at most 15 μΩ·cm and at least 5%, respectively.
Inventors:
SUEYASU SHIORI (JP)
WATANABE SHU (JP)
WATANABE SHU (JP)
Application Number:
PCT/JP2023/011397
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
NISSHIN ENG INC (JP)
International Classes:
B22F1/00; B22F1/05; B22F1/102; B22F9/12; B22F9/14; H01B5/00
Domestic Patent References:
| WO2021100559A1 | 2021-05-27 | |||
| WO2022045263A1 | 2022-03-03 | |||
| WO2021039361A1 | 2021-03-04 |
Foreign References:
| JP2019108610A | 2019-07-04 | |||
| JP2007270334A | 2007-10-18 | |||
| JP2013139589A | 2013-07-18 | |||
| JP2023057992A | 2023-04-24 |
Attorney, Agent or Firm:
ITOH Hideaki (JP)
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