Title:
SILVER NANOPARTICLE-EMBEDDED COPPER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/145627
Kind Code:
A1
Abstract:
The present invention relates to a silver nanoparticle-embedded copper substrate. The substrate comprises: a copper substrate having pores formed on the surface thereof; and silver nanoparticles partially or entirely embedded in the copper substrate through the pores. The silver nanoparticle-embedded copper substrate has silver nanoparticles partially or entirely embedded in the pores and as such, is more unlikely to be disassembled, compared to the copper substrate having a film of silver formed thereon, whereby the present invention can continually provide a copper substrate having improved conductivity and excellent durability.
Inventors:
JO OK RAE (KR)
KIM SUNG HOON (KR)
KIM DO YUL (KR)
KIM TAE HYUNG (KR)
KIM HONG JE (KR)
KIM SUNG HOON (KR)
KIM DO YUL (KR)
KIM TAE HYUNG (KR)
KIM HONG JE (KR)
Application Number:
PCT/KR2021/000352
Publication Date:
July 22, 2021
Filing Date:
January 11, 2021
Export Citation:
Assignee:
JO OK RAE (KR)
International Classes:
H01B1/02; C23C26/00; C23F1/18; C23F1/34; C23F4/00; H01F1/04; H01F27/28
Foreign References:
| KR20040080466A | 2004-09-20 | |||
| JP2017110295A | 2017-06-22 | |||
| KR20110064703A | 2011-06-15 | |||
| KR20180055490A | 2018-05-25 | |||
| KR102181676B1 | 2020-11-24 |
Attorney, Agent or Firm:
KIM, Jong Sun (KR)
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