Title:
SILVER PASTE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/035908
Kind Code:
A1
Abstract:
A silver paste composition which comprises A) a silver salt of an inorganic acid and/or a silver salt of organic acid, B) an organic binder, and C) a solvent, wherein the content of the silver derived from said component A) is 10 to 50 wt % relative to the total amount of said composition. The above silver paste composition is novel and can provide a silver thin film which has a thickness of 2.5 microns or less, is dense, is stable and exhibits a low sheet resistance value, and thus can be suitably used as a thin film conducting material for various electronic parts (a thin film electrode of a resistor) and a wiring material for a display device.
Inventors:
OCHIAI NAOSUKE (JP)
Application Number:
PCT/JP2005/018030
Publication Date:
April 06, 2006
Filing Date:
September 29, 2005
Export Citation:
Assignee:
NIPPON KIN EKI CO LTD (JP)
OCHIAI NAOSUKE (JP)
OCHIAI NAOSUKE (JP)
International Classes:
H01B1/20; G03F7/004; H01B1/00; H05K1/09
Foreign References:
| JPH02208373A | 1990-08-17 | |||
| JP2002117720A | 2002-04-19 | |||
| JPH11317112A | 1999-11-16 | |||
| JPS6055024A | 1985-03-29 | |||
| JP2004139754A | 2004-05-13 |
Other References:
ONO A. AND KONDO N.: "Kododen Gin Paste o Tekiyo shita Membrane Haisenban. (Printed Circuit Board Using Highly-Conductive Silver Paste)", JOURNAL OF JAPAN INSTITUTE OF ELECTRONICS PACKAGING, vol. 7, no. 6, 1 September 2004 (2004-09-01), pages 482 - 486, XP002998157
Attorney, Agent or Firm:
Yamamoto, Shusaku (Crystal Tower 2-27, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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