Title:
SILVER PASTE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING JOINTED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/125161
Kind Code:
A1
Abstract:
A silver paste containing a silver powder (12) and a binder (14), the silver paste being used in order to form a silver paste layer (13) by directly applying the silver paste to a surface (11a) of a copper or copper-alloy member. The binder (14) contains at least fatty acid silver and an aliphatic amine, and the exchange current density of the binder (14) is within the range from 10 μA/dm2 to 1000 μA/dm2 (inclusive). The binder (14) preferably contains one or more selected from diethylene glycol, triethylene glycol, polyethylene glycol, or benzoic acid as an additive. The proportion of additive contained in the binder (14) is preferably within the range from 0.003-0.333 (inclusive) in terms of a mass ratio (additive/binder).
Inventors:
YASOSHIMA TSUKASA (JP)
IWATA KOTARO (JP)
KATASE TAKUMA (JP)
IWATA KOTARO (JP)
KATASE TAKUMA (JP)
Application Number:
PCT/JP2020/046723
Publication Date:
June 24, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F1/00; B22F7/08; B22F9/00; B82Y30/00; B82Y40/00; H01B1/00; H01B1/22; H01B13/00; H01L21/52; H05K3/32
Domestic Patent References:
| WO2012133767A1 | 2012-10-04 |
Foreign References:
| JP2008176951A | 2008-07-31 | |||
| JP2008198595A | 2008-08-28 | |||
| CN108102579A | 2018-06-01 | |||
| JP2020204335A | 2020-12-24 | |||
| JP5872545B2 | 2016-03-01 | |||
| JPS6329703B2 | 1988-06-15 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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