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Title:
SILVER PASTE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING JOINED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/125336
Kind Code:
A1
Abstract:
A silver paste which can be used for the formation of a silver paste layer by applying the silver paste directly onto a surface of a copper member or a copper alloy member, the silver paste comprising a silver powder, a silver salt of a fatty acid, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. It is preferred that the content of the high-dielectric-constant alcohol is 0.01 to 5% by mass wherein the content of the silver paste is 100% by mass.

Inventors:
YASOSHIMA TSUKASA (JP)
MASUYAMA KOTARO (JP)
OTOGAWA KOHEI (JP)
KATASE TAKUMA (JP)
Application Number:
PCT/JP2020/047489
Publication Date:
June 24, 2021
Filing Date:
December 18, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F1/00; B22F7/08; B22F9/00; B82Y30/00; B82Y40/00; H01B1/00; H01B1/22; H01B13/00; H01L21/52; H05K3/32
Domestic Patent References:
WO2012133767A12012-10-04
Foreign References:
JP2008176951A2008-07-31
JP2008198595A2008-08-28
CN108102579A2018-06-01
JP2019230645A2019-12-20
JP2020204337A2020-12-24
JP5872545B22016-03-01
JPS6329703B21988-06-15
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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