Title:
SILVER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/137331
Kind Code:
A1
Abstract:
This silver paste containing at least a silver powder, a binder resin and an organic solvent is characterized in that the silver powder satisfies all of conditions [1] to [4]: [1] in a volume-based cumulative fraction from a laser diffraction type particle size distribution measurement, when D50 represents the 50% value, the silver powder contains a first silver powder (a) having a D50 of 3.50 to 7.50 μm, and a second silver powder (b) having a D50 of 0.80 to 2.00 μm; [2] the copper content of all the silver powder is 10 to 5,000 ppm by mass; [3] the copper content of the second silver powder (b) is 80 ppm by mass or higher; [4] the first silver powder (a) does not substantially contain copper. According to the present invention, a silver paste containing a high concentration of powder and having excellent printability can be provided, thereby allowing a silver conductor film to be provided having high fill rate and film density, exhibiting high electrical conductivity, and having excellent resistance to migration.
Inventors:
NISHIMURA KOUSUKE (JP)
SHINDO NAOTO (JP)
MASHIMA HIROSHI (JP)
AKIMOTO YUJI (JP)
SHINDO NAOTO (JP)
MASHIMA HIROSHI (JP)
AKIMOTO YUJI (JP)
Application Number:
PCT/JP2019/046482
Publication Date:
July 02, 2020
Filing Date:
November 28, 2019
Export Citation:
Assignee:
SHOEI CHEMICAL IND CO (JP)
International Classes:
B22F1/10; B22F1/12; B22F7/04; C22C5/08; H01B1/00; H01B1/02; H01B1/22
Domestic Patent References:
| WO2018025627A1 | 2018-02-08 |
Foreign References:
| JP2011021271A | 2011-02-03 | |||
| JP2018055883A | 2018-04-05 |
Attorney, Agent or Firm:
ASHITABA INTERNATIONAL PATENT OFFICE (JP)
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