SILVER-PLATED MATERIAL AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2023/188637

A1

The present invention provides: a silver-plated material wherein a silver plating film is not easily separated from a base plating film and exhibits excellent adhesion in a high-temperature high-humidity environment in cases where the silver plating film is formed on a base material with the base plating film being interposed therebetween; and a method for producing this silver-plated material. According to the present invention, after forming a base silver plating film (which preferably has a thickness of 0.06-15 µm) on a base material (which is preferably formed of copper or a copper alloy) with a base plating film (which is preferably formed of copper, nickel or an alloy of these metals) being interposed therebetween, a surface layer (a silver plating film containing carbon and sulfur) which is formed of silver and contains carbon and sulfur (the surface layer preferably having a thickness of 0.1-2.0 µm) is formed on the base silver plating film by performing electroplating in a silver plating solution which is composed of an aqueous solution that contains silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof.

FUNADA ERI (JP)
ARAI KENTARO (JP)
SATO YOSUKE (JP)
HIRAI YUTARO (JP)

PCT/JP2022/047637

October 05, 2023

December 23, 2022

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DOWA METALTECH CO LTD (JP)

C25D5/10; C25D3/46; C25D5/12; C25D7/00; H01R13/03

JP6916971B1	2021-08-11
JPH01156495A	1989-06-20

OKAWA Koichi (JP)

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