Title:
SILVER POWDER COATED WITH SILVER COMPOUND AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/099939
Kind Code:
A1
Abstract:
A silver compound coated silver powder for a conductive paste for forming a conductive wiring part of an electronic circuit by using a silver powder coated with a silver compound having a decomposition temperature lower than the melting point of silver, and a manufacturing method thereof. The silver compound coated silver powder includes silver compound coated silver particles, the surfaces of which are coated with the silver compound. At the time of baking a board whereupon the electronic circuit wiring is to be formed by the conductive paste including the silver powder, the silver in the silver compound mutually fuses the silver compound coated silver particles by heat decomposition of the silver compound having the decomposition temperature much lower than the melting point of silver.
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Inventors:
SASAKI TAKUYA (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)
Application Number:
PCT/JP2005/007005
Publication Date:
October 27, 2005
Filing Date:
April 11, 2005
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
SASAKI TAKUYA (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)
SASAKI TAKUYA (JP)
SAKAUE TAKAHIKO (JP)
FUJIMOTO TAKU (JP)
YOSHIMARU KATSUHIKO (JP)
International Classes:
C08K9/00; B22F1/16; C08L101/00; C23C22/06; C23C24/10; C23C26/00; C23C26/02; H01B1/02; H01B1/22; H01B5/00; H05K1/09; H05K3/40; (IPC1-7): B22F1/02; B22F1/00; H01B5/00; H01B1/22; C23C26/00; C08K9/00
Foreign References:
| JP2000219901A | 2000-08-08 | |||
| JP2002334614A | 2002-11-22 | |||
| JPH1088207A | 1998-04-07 | |||
| JP2000129318A | 2000-05-09 |
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International (Patent Office Omiya Fbldg., 5-4, Sakuragicho
2-chome, Omiya-ku, Saitama-sh, Saitama 54, JP)
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