SINGLE-CHIP INTEGRATED ULTRAVIOLET FOCAL PLANAR DEVICE AND PREPARATION METHOD THEREFOR

WIPO Patent Application WO/2017/190392

A1

A single-chip integrated ultraviolet focal planar device (2) and a preparation method therefor. The device comprises: a photodiode array and a readout circuit (23) prepared on the same substrate (21). The method comprises: providing a substrate (21), etching a groove (211) on the substrate (21) according to a design layout, and determining the position of each photosensitive element (22); using an epitaxial growth technique to form an N-type epitaxial layer (221) and a P-type epitaxial layer (222), layer by layer, in the groove (211); etching the P-type epitaxial layer (222) to expose a part of the N-type epitaxial layer (221); preparing, on the substrate (21), various devices in a readout circuit (23); and manufacturing an electrode of each photosensitive element (22), and connecting each electrode to a corresponding device in the readout circuit (23) via a metal wire. According to the single-chip integrated ultraviolet focal planar device (2) and the preparation method therefor, a photodiode array and a readout circuit (23) are prepared on the same substrate (21), thereby avoiding complex preparation processes, such as bonding, improving the product yield, simplifying the production process, reducing the production cost, and facilitating the mass production of the ultraviolet focal planar device.

LI CHENG (CN)

PCT/CN2016/083874

November 09, 2017

May 30, 2016

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LI CHENG (CN)

H01L27/146

CN101661943A	2010-03-03
CN1481585A	2004-03-10
CN104505410A	2015-04-08
CN104362199A	2015-02-18
US5625210A	1997-04-29
US20130214161A1	2013-08-22
CN103594468A	2014-02-19

J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (CN)

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