Title:
SINGLE-COMPONENT ORGANIC SILICON-MODIFIED SEALANT CAPABLE OF BEING RAPIDLY DEEP-LAYER CURED AT LOW TEMPERATURE, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/160197
Kind Code:
A1
Abstract:
The present invention discloses a single-component organic silicon-modified sealant and a preparation method therefor. The single-component organic silicon-modified sealant is prepared from the following raw materials: 15 to 40 parts of a trimethoxy silane-terminated polyurea resin, 20 to 50 parts of a reinforcing filler, 3 to 10 parts of a functional filler and 10 to 50 parts of a plasticizer, 0.2 to 1.5 parts of a humectant, 0.1 to 2 parts of a rheological agent, 0.5 to 2 parts of a stabilizer, 0.5 to 2 parts of a water removal agent, 0.5 to 2 parts of a coupling agent, and 0.1 to 3 parts of a catalyst. The functional filler is surface-modified calcium oxide. The deep-layer curing depth of the single-component organic silicon-modified sealant at a low temperature (about 0°C) within 24 hours is greater than or equal to 3 mm, and has good mechanical property after curing.
Inventors:
CHEN YANGQING (CN)
CHEN JIANJUN (CN)
HUANG HENGCHAO (CN)
GAO MINHUA (CN)
TANG HUA (CN)
CHEN JIANJUN (CN)
HUANG HENGCHAO (CN)
GAO MINHUA (CN)
TANG HUA (CN)
Application Number:
PCT/CN2022/141393
Publication Date:
August 31, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
GUANGZHOU BAIYUN CHEMICAL IND CO LTD (CN)
GUANGDONG BAIYUN TECH CO LTD (CN)
GUANGDONG BAIYUN TECH CO LTD (CN)
International Classes:
C08G18/50; C09J175/02; C08G18/83; C09J11/04
Domestic Patent References:
WO2004085565A1 | 2004-10-07 | |||
WO1998018843A1 | 1998-05-07 |
Foreign References:
CN114479741A | 2022-05-13 | |||
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CN102666648A | 2012-09-12 |
Attorney, Agent or Firm:
GUANGZHOU PRIME IP LAW OFFICE (CN)
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