SINGLE PLATE OVERLAPPING METHOD

WIPO Patent Application WO/2016/157598

A1

A single plate overlapping method includes: a parallel single plate waiting step of causing a pasted parallel single plate 100 to wait on a post-pasting conveyor 33; a cross single plate moving step of separately moving a cross single plate 200 from a cross single plate supplying device 34 onto a pre-pasting conveyor 31; a cross single plate positioning step of positioning the cross single plate 200 at a reference position of the pre-pasting conveyor 31; a cross single plate waiting step of causing the positioned cross single plate 200 to wait in a position above the pre-pasting conveyor 31; a parallel single plate returning step of returning the parallel single plate 100 in the waiting state onto the pre-pasting conveyor 31; a parallel single plate positioning step of positioning the returned parallel single plate 100 at the reference position of the pre-pasting conveyor 31; an overlapping step of overlapping the cross single plate 200 in the waiting state on the positioned parallel single plate 100; and an overlapped single plate pasting step of pasting an upper surface of the cross single plate 200. Thus, an overlapped single plate is obtained in which a mutual adhesion degree is high and corresponding edges substantially align with each other.

OKUMURA TAKUYA (JP)
KOCHI YUKI (JP)
MURAKAMI TAKUJI (JP)

PCT/JP2015/081689

October 06, 2016

November 11, 2015

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TAIHEI SEISAKUSHO KK (JP)

B27D1/04

JPH0994807A	1997-04-08
JPH10225908A	1998-08-25

HARIKAWA, Takashi (JP)
張川 Takashi (JP)

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