SINTERED RESIN PRODUCT AND ELECTRONIC DEVICE COMPRISING THE SAME

WIPO Patent Application WO/2007/129640

A1

Disclosed are a sintered resin product having excellent heat resistance, and an electronic device comprising such a sintered resin product. Specifically disclosed is a sintered resin product obtained by sintering a resin composition comprising a main-chain type aromatic benzoxazine structure. The sintered resin product has a peak at 58 ± 2 ppm according to a measurement using 13C NMR, and the half bandwidth of the peak is within the range of 4-10 ppm. Also specifically disclosed is a method for producing a sintered resin product wherein a resin composition comprising a main-chain type aromatic benzoxazine structure is sintered at a temperature not less than 270˚C but not more than 350˚C. Further specifically disclosed is an electronic device comprising such a sintered resin product.

JP2009001727	METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITE MATERIAL, THERMOSETTING RESIN COMPOSITE MATERIAL OBTAINED BY THE METHOD, AND FRICTION MATERIAL USING THE MATERIAL
JP5552074	A thermosetting resin composition and its hardened material

CHIKU YOSHINORI (JP)
EGUCHI YUJI (JP)
DOYAMA KAZUO (JP)

PCT/JP2007/059308

November 15, 2007

May 01, 2007

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SEKISUI CHEMICAL CO LTD (JP)
CHIKU YOSHINORI (JP)
EGUCHI YUJI (JP)
DOYAMA KAZUO (JP)

C08L61/34; C08G14/073

JP2004103495A	2004-04-02
JP2003292728A	2003-10-15
JPH09176263A	1997-07-08
JPH0959334A	1997-03-04

INABA, Yoshiyuki et al. (Roppongi Hills Mori Tower6-10-1, Roppong, Minato-ku Tokyo 23, JP)

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