Title:
SIP MODULE
Document Type and Number:
WIPO Patent Application WO/2022/225314
Kind Code:
A1
Abstract:
A SiP module according to the embodiment comprises: a substrate; an image sensor disposed on one surface of the substrate; and a serializer embedded inside the substrate. The substrate includes a via hole that passes through the substrate in order to electrically connect the image sensor and the serializer.
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Inventors:
CHOI BYUNG HYUN (KR)
Application Number:
PCT/KR2022/005628
Publication Date:
October 27, 2022
Filing Date:
April 19, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L25/16; H01L23/34; H01L23/50; H01L23/538; H01L23/64; H01L27/146; H04N5/225
Foreign References:
| KR20110068796A | 2011-06-22 | |||
| KR101602706B1 | 2016-03-14 | |||
| JP2010093214A | 2010-04-22 | |||
| KR20120031817A | 2012-04-04 | |||
| JP2008305937A | 2008-12-18 |
Attorney, Agent or Firm:
JIN, Cheon Woong et al. (KR)
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