Title:
SIZING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/175955
Kind Code:
A1
Abstract:
A sizing device equipped with a turntable pressed by upper and lower punches, the turntable being provided with a plurality of accommodation holes that accommodate workpieces and rotating to transport the workpieces in each of the accommodation holes to a through hole of a die provided at a workpiece molding position as each of the accommodation holes moves from a workpiece supply position to a workpiece removal position, wherein the sizing device is equipped with: a plurality of identifying information holding units that correspond to the accommodation holes and store tag codes; a supply-side input unit for inputting a tag code to the identifying information holding unit corresponding to the accommodation hole at the workpiece supply position when a workpiece is accommodated in the accommodation hole at the workpiece supply position; a molding position reading unit that reads the tag code of the identifying information holding unit corresponding to the accommodation hole at the workpiece molding position; a punch control unit that controls driving of the upper and lower punches, which press the workpiece in the through hole of the die, on the basis of the tag code read by the molding position reading unit; and a molding position input unit for inputting a new tag code to the identifying information holding unit corresponding to the accommodation hole at the workpiece molding position in association with completion of pressurization of the upper and lower punches.
Inventors:
HAYASHI SHINJI (JP)
TAKEUCHI KENJI (JP)
TAKEUCHI KENJI (JP)
Application Number:
PCT/JP2018/009653
Publication Date:
September 19, 2019
Filing Date:
March 13, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC SINTERED ALLOY LTD (JP)
International Classes:
B22F3/24
Foreign References:
| JP2013174450A | 2013-09-05 | |||
| JP2011080113A | 2011-04-21 |
Attorney, Agent or Firm:
YAMANO, Hiroshi (JP)
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