SKIN LIFTING METHOD USING MICRONEEDLE HAVING DEFORMED STRUCTURE AND SKIN DRESSING PAD

Title:

SKIN LIFTING METHOD USING MICRONEEDLE HAVING DEFORMED STRUCTURE AND SKIN DRESSING PAD

Document Type and Number:

WIPO Patent Application WO/2020/166744

Kind Code:

A1

Abstract:

The present invention relates to a skin lifting method using a microneedle having a deformed structure and a skin dressing pad and, more specifically, to a skin lifting method comprising the steps of: attaching the skin dressing pad onto a skin; perforating the skin using the microneedle to remove a part of the skin tissue and injecting a drug for skin lifting into the perforated skin; and closing the perforated skin by the contraction of the skin dressing pad, wherein the microneedle may be a hollow microneedle which has an inwardly curved structure having a ∩-shape.

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Inventors:

LEE JIN WOO (KR)

Application Number:

PCT/KR2019/001858

Publication Date:

August 20, 2020

Filing Date:

February 15, 2019

Export Citation:

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Assignee:

HIRONIC COLTD (KR)

International Classes:

A61M37/00; A61F13/00; A61F13/02; A61K9/70

Domestic Patent References:

WO2013188884A1

2013-12-19

Foreign References:

KR20110083709A	2011-07-20
JPS6261795B2	1987-12-23
JP6375435B1	2018-08-15
KR20140010430A	2014-01-24
KR101386490B1	2014-04-21

Attorney, Agent or Firm:

OLIM IP & LAW FIRM (KR)

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