Title:
SLIDE MATERIAL AND METHOD FOR MANUFACTURING SAME, AND SLIDE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/061332
Kind Code:
A1
Abstract:
Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass% of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is 2.0% or less. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.
Inventors:
TODA KAZUAKI (JP)
Application Number:
PCT/JP2017/021350
Publication Date:
April 05, 2018
Filing Date:
June 08, 2017
Export Citation:
Assignee:
DAIDO METAL CO (JP)
International Classes:
C22C9/00; B22D19/16; B22D27/04; C22C1/02; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; F16C33/12; F16C33/14
Domestic Patent References:
| WO2010030031A1 | 2010-03-18 |
Foreign References:
| JP2001081523A | 2001-03-27 | |||
| JP2013043997A | 2013-03-04 | |||
| JP2011174118A | 2011-09-08 | |||
| JP2002285262A | 2002-10-03 | |||
| JP2012207277A | 2012-10-25 |
Other References:
See also references of EP 3521464A4
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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