Title:
SLOTTING DEVICE FOR RESIN FLUX CORED SOLDER
Document Type and Number:
WIPO Patent Application WO/2003/055639
Kind Code:
A1
Abstract:
A slotting device for resin flux cored solder capable of slotting a resin flux cored solder, comprising a disk-like slotting blade for slotting the solder, a drive means for rotatingly driving the slotting blade, a guide roller having V-shaped guide grooves on a circumference and positioning the solder when slotting the solder, and a feed nozzle for leading the solder from a reel stand to the guide roll, wherein the feeding direction line of the solder supplied from the solder outlet of the feed nozzle is equal to an arc tangential line formed by the center line of the solder in the state of the solder positioned along the guide groove, a guide start point on the arc from which the solder is guided completely is positioned on the upstream side of a cutting point which is the intersection of the arc with a straight line connecting the rotating center of the slotting blade to the rotating center of the guide roller, the center angle of the arc between the guide start point and the cutting point is an acute angle of 5° or more, and the rotating center of the slotting blade is positioned on the opposite side of the rotating center of the guide roller with respect to the feeding direction line.
More Like This:
Inventors:
FUSAMURA TOMOAKI (JP)
Application Number:
PCT/JP2002/013418
Publication Date:
July 10, 2003
Filing Date:
December 24, 2002
Export Citation:
Assignee:
HAKKO CORP (JP)
FUSAMURA TOMOAKI (JP)
FUSAMURA TOMOAKI (JP)
International Classes:
B23K3/06; B23K35/02; B23K35/40; (IPC1-7): B23K35/40; B23K3/06
Foreign References:
| JPH03101363U | 1991-10-22 | |||
| JPS5365241A | 1978-06-10 |
Attorney, Agent or Firm:
Kotani, Etsuji (Nakanoshima 2-chome Kita-ku Osaka-shi, Osaka, JP)
Download PDF: