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Patent Searching and Data


Title:
SLURRY CLEANING DEVICE AND CLEANING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/080190
Kind Code:
A1
Abstract:
 Provided is a slurry cleaning device with which it is possible to clean, efficiently and over a shorter period of time, slurry containing toner mother particles and resin particles. This slurry cleaning device comprises a cleaning chamber in which slurry is brought into contact with rinse water, and a flow control device that controls the flow of the slurry. The flow control devices are positioned at the slurry supply port through which slurry is supplied to the cleaning chamber, and at the slurry discharge port through which slurry is discharged from the cleaning chamber. The cleaning chamber has at least one filtration surface through which water can pass, and the slurry is made to flow at a fixed flow rate through a space which is in contact with the filtration surface; the cleaning water is supplied to the cleaning chamber, and after coming into contact with the slurry that flows through the space, passes through the filtration surface.

Inventors:
XU YUQING (JP)
Application Number:
PCT/JP2014/081335
Publication Date:
June 04, 2015
Filing Date:
November 27, 2014
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B01D29/11; B01D37/04; B01D29/17; B01D29/25; B01D29/37; B01J19/00; B03B5/00; C02F11/12; G03G9/087
Foreign References:
JP2004261775A2004-09-24
JPS58132519U1983-09-07
JPS6384655A1988-04-15
JP2012166191A2012-09-06
JP2013205488A2013-10-07
JP2005531393A2005-10-20
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES (JP)
Patent business corporation Tsukuni (JP)
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