Title:
SLURRY FOR POLISHING
Document Type and Number:
WIPO Patent Application WO/2019/131885
Kind Code:
A1
Abstract:
Provided is a slurry for polishing, which is used for polishing of an interlayer insulating film, and which contains silica abrasive grains and organic ammonium cations that have a molecular weight of 155 or less.
Inventors:
KIMURA HIROSHI (JP)
Application Number:
PCT/JP2018/048163
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
NITTA HAAS INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2015005433A1 | 2015-01-15 |
Foreign References:
| JP2009081200A | 2009-04-16 | |||
| US5139571A | 1992-08-18 |
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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