Title:
SOCKET FOR ELECTRONIC COMPONENT TEST, AND ELECTRONIC COMPONENT TEST APPARATUS USING THE SOCKET
Document Type and Number:
WIPO Patent Application WO/2002/046781
Kind Code:
A1
Abstract:
An electronic component test apparatus capable of controlling the temperature of a socket for electronic component test such as an IC socket without generating noise in the test signals applied to electronic components such as IC devices and response signals read from the electronic components such as IC devices, wherein a first space (67) in a socket base (6) for electronic component test is allowed to communicate with a socket body internal space (75) in a socket (7) for electronic component test through a gas outlet (65) and a gas inlet (76), and a second space (68) in the socket base (6) for electronic component test is allowed to communicate with the socket body internal space (75) in the socket (7) for electronic component test through a gas inlet (66) and a gas outlet (77).
Inventors:
ISHIKAWA TAKAJI (JP)
NAKAMURA HIROTO (JP)
NAKAMURA HIROTO (JP)
Application Number:
PCT/JP2001/010729
Publication Date:
June 13, 2002
Filing Date:
December 07, 2001
Export Citation:
Assignee:
ADVANTEST CORP (JP)
ISHIKAWA TAKAJI (JP)
NAKAMURA HIROTO (JP)
ISHIKAWA TAKAJI (JP)
NAKAMURA HIROTO (JP)
International Classes:
G01R31/26; G01R1/06; G01R1/073; G01R31/01; G01R31/28; H01R33/76; G01R1/04; (IPC1-7): G01R31/26; H01L21/66
Foreign References:
| JPS6165173A | 1986-04-03 | |||
| JP2001051017A | 2001-02-23 | |||
| JPH01151266U | 1989-10-19 | |||
| JPS5974729U | 1984-05-21 |
Attorney, Agent or Firm:
Hayakawa, Yuzi (Hikawa-Annex No.2 9-5 Akasaka 6-chome Minato-ku, Tokyo, JP)
Download PDF: