Title:
SOCKET FOR INSPECTING SEMICONDUCTOR PACKAGE AND SUBSTRATE, FLEXIBLE CONTACT PIN USED THEREIN, AND METHOD FOR MANUFACTURING FLEXIBLE CONTACT PIN
Document Type and Number:
WIPO Patent Application WO/2015/182885
Kind Code:
A1
Abstract:
The present invention relates to a socket for inspecting a semiconductor package and a substrate, a flexible contact pin used therein, and a method for manufacturing the flexible contact pin, the socket comprising: a seat portion made of a rubber material and having a plurality of through holes; and a flexible contact pin having one end connected with a solder ball to be tested and the other end connected with a terminal of a test device.
Inventors:
SHIN JAE HO (KR)
Application Number:
PCT/KR2015/004215
Publication Date:
December 03, 2015
Filing Date:
April 28, 2015
Export Citation:
Assignee:
INASC CO LTD (KR)
International Classes:
G01R1/073; G01R31/26
Foreign References:
| KR200312740Y1 | 2003-05-13 | |||
| KR101039569B1 | 2011-06-09 | |||
| KR200316878Y1 | 2003-06-19 | |||
| KR101204939B1 | 2012-11-26 |
Attorney, Agent or Firm:
LEE, SUNG KOO (KR)
이성구 (KR)
이성구 (KR)
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