Title:
SOIL REMOVAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/019030
Kind Code:
A1
Abstract:
The present invention provides a soil removal device with no risk of lowering of the product value. The soil removal device includes: a detection means 23 that is attached to a soil removal plate 22 mounted on a work machine 10 and acquires posture information of the soil removal plate 22; and a control unit 32 to which the posture information is input. When the control unit 32 (calculation unit 32a) determines, on the basis of the posture information, that there is an abnormal state in which the height h from the ground surface P1 to the lower end of the soil removal plate 22 in the work machine 10 is not within a predetermined reference height range, the control unit 32 operates a notification unit 33 to notify an operator to that effect using the notification unit 33.
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Inventors:
NAGAMINE TAKUYA
HUANG KANG
HUANG KANG
Application Number:
PCT/JP2023/026188
Publication Date:
January 25, 2024
Filing Date:
July 18, 2023
Export Citation:
Assignee:
NIPPON SEIKI CO LTD (JP)
International Classes:
E02F3/84
Domestic Patent References:
| WO2019124549A1 | 2019-06-27 |
Foreign References:
| JP2020041279A | 2020-03-19 | |||
| JP2020165255A | 2020-10-08 | |||
| US20160076223A1 | 2016-03-17 |
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