SOLDER ALLOY, SOLDER BALL, CHIP SOLDER, SOLDER PASTE AND SOLDER JOINT

Title:

SOLDER ALLOY, SOLDER BALL, CHIP SOLDER, SOLDER PASTE AND SOLDER JOINT

Document Type and Number:

WIPO Patent Application WO/2016/189900

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a solder alloy, solder ball, chip solder, solder paste and solder joint in which discoloration is suppressed and growth of oxide films is suppressed in high temperature and high humidity environments. The solder alloy contains 0.005-0.1 mass% of Mn and 0.001-0.1 mass% of Ge, with the remainder comprising Sn as a primary component. By adding 0.005-0.1 mass% of Mn and 0.001-0.1 mass% of Ge to a solder alloy comprising Sn as a primary component, Ge oxides are distributed largely on the outermost surface side of an oxide film containing oxides of Sn, oxides of Mn and oxides of Ge, and a discoloration prevention effect can be obtained even in high humidity environments. In addition, because Mn reacts with O2, reactions between Sn and O2 are suppressed and the generation of oxides of Sn is suppressed, and as a result thereof, an increase in the thickness of an oxide film is suppressed and fusion properties are improved.

More Like This:

WO/2018/100793	BRAZING SHEET AND PRODUCTION METHOD THEREFOR
JP2018144076	METAL POWDER FOR PRODUCING SOLDER BUMP, PASTE FOR PRODUCING SOLDER BUMP AND PRODUCTION METHOD OF SOLDER BUMP
JPH07188822	AL ALLOY CLAD MATERIAL FOR STRUCTURAL MEMBER OF AUTOMOTIVE HEAT EXCHANGER EXCELLENT IN PITTING CORROSION RESISTANCE

Inventors:

TACHIBANA KEN (JP)
HATTORI TAKAHIRO (JP)

Application Number:

PCT/JP2016/054345

Publication Date:

December 01, 2016

Filing Date:

February 15, 2016

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B23K35/22; B23K35/26; C22C13/00; C22C13/02; H05K3/34

Foreign References:

JP2014027122A	2014-02-06
JP2009506203A	2009-02-12

Other References: