Title:
SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME
Document Type and Number:
WIPO Patent Application WO/2007/081006
Kind Code:
A1
Abstract:
Disclosed is a Pb-free solder alloy consisting of, in mass%, 0.1-1.5% of Ag, 0.5-0.75% of
Cu, Ni in an amount satisfying 12.5 ≤ Cu/Ni ≤ 100, and the balance of
Sn and unavoidable impurities. The solder alloy preferably contains, in mass%, 0.3-1.2%
of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing
the solder alloy. In addition, the solder alloy is suitable for a solder joint
onto an Ni electrode. The solder alloy has excellent drop impact resistance,
while being suppressed in decrease of joining strength under high temperature
conditions for a long time.
Inventors:
FUJIYOSHI MASARU (JP)
DATE MASAYOSHI (JP)
DATE MASAYOSHI (JP)
Application Number:
PCT/JP2007/050421
Publication Date:
July 19, 2007
Filing Date:
January 15, 2007
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
FUJIYOSHI MASARU (JP)
DATE MASAYOSHI (JP)
FUJIYOSHI MASARU (JP)
DATE MASAYOSHI (JP)
International Classes:
B23K35/26; C22C13/00; H05K3/34
Foreign References:
| JP2003230980A | 2003-08-19 | |||
| JP2002239780A | 2002-08-28 | |||
| JP2002057177A | 2002-02-22 | |||
| JP2001096394A | 2001-04-10 | |||
| JPH11277290A | 1999-10-12 | |||
| JPH1177366A | 1999-03-23 | |||
| JPH11221695A | 1999-08-17 | |||
| JP2000190090A | 2000-07-11 | |||
| JP2003230980A | 2003-08-19 |
Other References:
See also references of EP 1974850A4
Attorney, Agent or Firm:
ASAMURA, Kiyoshi et al. (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, JP)
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