Title:
SOLDER ALLOY, SOLDER JOINING MEMBER, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/100383
Kind Code:
A1
Abstract:
Provided are a solder alloy, a solder joining member, a solder paste, and a semiconductor package with which it is possible to suppress any separation of a solder joining part and a semiconductor element at the interface between these two components. This solder alloy contains 1.1-8 mass% inclusive of Cu, 6-20 mass% inclusive of Sb, 0.01-0.5 mass% inclusive of Ni, and 0.001-1 mass% of Co, the balance being Sn.
Inventors:
NARUSE SHOUICHIROU (JP)
NAKANO TAKESHI (JP)
SAKAMOTO ISAO (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
NAKANO TAKESHI (JP)
SAKAMOTO ISAO (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
Application Number:
PCT/JP2022/008701
Publication Date:
June 08, 2023
Filing Date:
March 01, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/02; H05K3/00
Domestic Patent References:
| WO2019058650A1 | 2019-03-28 | |||
| WO2019188756A1 | 2019-10-03 |
Foreign References:
| JP2018518368A | 2018-07-12 | |||
| CN109500510A | 2019-03-22 | |||
| KR20190028985A | 2019-03-20 | |||
| JPH0216013B2 | 1990-04-13 | |||
| JPH0342865B2 | 1991-06-28 | |||
| JPH0473143B2 | 1992-11-20 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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