SOLDER ALLOY FOR OXIDE BONDING

Title:

SOLDER ALLOY FOR OXIDE BONDING

Document Type and Number:

WIPO Patent Application WO/2007/007840

Kind Code:

A1

Abstract:

Disclosed is a lead-free metal solder material which enables to attain excellent bonding strength and hermetic sealing. Specifically disclosed is a solder alloy for oxide bonding which is composed of, in mass%, 2.0-15.0% of Ag, more than 0.1% to 6.0% of Al and the balance of Sn and unavoidable impurities. The amount of Al is preferably 0.3-3.0%, and more preferably 0.5-1.5%. The amount of Ag is preferably 3.0-13.0%, more preferably more than 5.0% to 12.0%, and still more preferably 6.0-10.0%. The relation between Ag and Al preferably satisfies 0 < [(%Ag) - (%Al) × 7.8] < 10.

More Like This:

WO/2005/020281	PROCESS AND ELECTRONIC ASSEMBLY FOR REMOVING HEAT FROM A CIRCUIT DEVICE
JP2011067849	BRAZING FILLER METAL, AND HEAT RADIATION BASE BODY JOINED BY USING THE SAME
WO/2009/075314	SOLDER ALLOY AND PROCESS FOR PRODUCING THE SAME

Inventors:

YAMADA MINORU (JP)
CHIWATA NOBUHIKO (JP)

Application Number:

PCT/JP2006/313983

Publication Date:

January 18, 2007

Filing Date:

July 13, 2006

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SOPHIA PRODUCT CO (JP)
HITACHI METALS LTD (JP)
YAMADA MINORU (JP)
CHIWATA NOBUHIKO (JP)

International Classes:

B23K35/26; C03C27/08; C04B37/00; C22C13/00

Foreign References:

JP2001058287A	2001-03-06
JP2000141078A	2000-05-23
JP2000119046A	2000-04-25
JPS333515B1

Attorney, Agent or Firm:

SUGIMURA, Kosaku et al. (2-4 Kasumigaseki 3-chom, Chiyoda-ku Tokyo 13, JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: METHOD FOR DETERMINATION OF ANIMAL SPECIES FROM WHICH INGREDIENT IN SAMPLE IS DERIVED, AND KIT FOR U...

Next Patent: PROCESS FOR PRODUCING BENZYLAMINE DERIVATIVE