Title:
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/002303
Kind Code:
A1
Abstract:
This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, copper, nickel, antimony, bismuth, and indium, essentially does not contain magnesium, and with respect to the total quantity of solder alloy, has a silver content of 0.05-0.2 mass% exclusive and an antimony content of at least 0.01 mass% and less than 2.5 mass%.
Inventors:
IMAMURA YOJI (JP)
IKEDA KAZUKI (JP)
PIAO JINYU (JP)
TAKEMOTO TADASHI (JP)
IKEDA KAZUKI (JP)
PIAO JINYU (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2012/079847
Publication Date:
January 03, 2014
Filing Date:
November 16, 2012
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/26; B23K1/00; C22C13/00; C22C13/02; H05K3/34; B23K35/22; B23K35/363; B23K101/42
Foreign References:
| JP4787384B1 | 2011-10-05 | |||
| JP2004261863A | 2004-09-24 | |||
| JP2004141910A | 2004-05-20 | |||
| JP2004188453A | 2004-07-08 | |||
| JP2005254298A | 2005-09-22 | |||
| JP4787384B1 | 2011-10-05 |
Other References:
See also references of EP 2868423A4
Attorney, Agent or Firm:
OKAMOTO, HIROYUKI (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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