Title:
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/003006
Kind Code:
A1
Abstract:
This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, antimony, bismuth, copper, and nickel, essentially does not contain germanium, and with respect to the total quantity of solder alloy, has a silver content of 1.0-1.2 mass% exclusive, an antimony content of 0.01-10 mass% inclusive, and a bismuth content of 0.01-3.0 mass% inclusive.
Inventors:
IMAMURA YOJI (JP)
IKEDA KAZUKI (JP)
PIAO JINYU (JP)
TAKEMOTO TADASHI (JP)
IKEDA KAZUKI (JP)
PIAO JINYU (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2013/067393
Publication Date:
January 03, 2014
Filing Date:
June 25, 2013
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; H05K3/34; B23K35/363
Domestic Patent References:
| WO2011102034A1 | 2011-08-25 | |||
| WO2006129713A1 | 2006-12-07 |
Foreign References:
| JP2005254298A | 2005-09-22 | |||
| JP4787384B1 | 2011-10-05 | |||
| JP4787384B1 | 2011-10-05 |
Other References:
See also references of EP 2868424A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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