Title:
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/013847
Kind Code:
A1
Abstract:
Provided is a tin/silver/copper solder alloy that contains tin, silver, copper, bismuth, nickel, and cobalt. When expressed relative to the total amount of the solder alloy, the silver content ratio is 2-4 mass%, the nickel content ratio is 0.01-0.15 mass%, and the cobalt content ratio is 0.001-0.008 mass%.
Inventors:
NAKANISHI KENSUKE (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
SHIGESADA TETSUYUKI (JP)
TAKEMOTO TADASHI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
SHIGESADA TETSUYUKI (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2013/067392
Publication Date:
January 23, 2014
Filing Date:
June 25, 2013
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; H05K3/34; B23K35/363
Domestic Patent References:
| WO2009011392A1 | 2009-01-22 | |||
| WO2009011392A1 | 2009-01-22 | |||
| WO2009011341A1 | 2009-01-22 |
Foreign References:
| JP2012061491A | 2012-03-29 | |||
| JP2001071173A | 2001-03-21 | |||
| JP2000015476A | 2000-01-18 |
Other References:
See also references of EP 2875898A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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