Title:
SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/098358
Kind Code:
A1
Abstract:
This solder alloy is substantially formed of tin, silver, copper, bismuth, antimony and cobalt. The content ratio of silver relative to the total amount of the solder alloy is from 2% by mass to 4% by mass (inclusive). The content ratio of copper is from 0.3% by mass to 1% by mass (inclusive). The content ratio of bismuth is more than 4.8% by mass but 10% by mass or less. The content ratio of antimony is from 3% by mass to 10% by mass (inclusive). The content ratio of cobalt is from 0.001% by mass to 0.3% by mass (inclusive). The content ratio of tin is the balance.
Inventors:
IKEDA KAZUKI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2015/055203
Publication Date:
June 23, 2016
Filing Date:
February 24, 2015
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/26; C22C13/02
Domestic Patent References:
| WO2006040582A1 | 2006-04-20 | |||
| WO2012056753A1 | 2012-05-03 |
Foreign References:
| JPH09181125A | 1997-07-11 | |||
| JP2006524572A | 2006-11-02 | |||
| JP2008521619A | 2008-06-26 | |||
| JP2015020182A | 2015-02-02 |
Other References:
See also references of EP 3235587A1
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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