SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

Title:

SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2016/098669

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass% inclusive and the remainder comprising Sn, and is used in electrical contacts that are electrically connected through mechanical joining.

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Inventors:

TSURUTA KAICHI (JP)
MUNEKATA OSAMU (JP)
IWAMOTO HIROYUKI (JP)
IKEDA ATSUSHI (JP)
MORIUCHI HIROYUKI (JP)
KAYAMA SHINICHI (JP)
TADOKORO YOSHIHIRO (JP)

Application Number:

PCT/JP2015/084560

Publication Date:

June 23, 2016

Filing Date:

December 09, 2015

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)
DDK LTD (JP)

International Classes:

B23K35/26; C22C13/00; H05K3/32; H05K3/34; H05K1/11

Foreign References:

JP2013221166A	2013-10-28
JP2007100148A	2007-04-19
JP2008021501A	2008-01-31
JPH11193494A	1999-07-21
JP2006249460A	2006-09-21

Other References: