Title:
SOLDER ALLOY AND SOLDERED JOINT
Document Type and Number:
WIPO Patent Application WO/2003/061896
Kind Code:
A1
Abstract:
A solder alloy which does not exert adverse influences on the environment and has soldering properties equal to those of conventional Pb−Sn solder alloys&semi and a soldered joint made with the solder alloy. The solder alloy consists of 4.0 to 10.0 wt.% zinc, 1.0 to 15.0 wt.% indium, 0.0020 to 0.0100 wt.% aluminum, and tin and unavoidable impurities as the remainder. The soldered joint made with the solder alloy is useful in electrical&sol electronic appliances.
Inventors:
KITAJIMA MASAYUKI (JP)
SHONO TADAAKI (JP)
TAKESUE MASAKAZU (JP)
NODA YUTAKA (JP)
SHONO TADAAKI (JP)
TAKESUE MASAKAZU (JP)
NODA YUTAKA (JP)
Application Number:
PCT/JP2002/000390
Publication Date:
July 31, 2003
Filing Date:
January 21, 2002
Export Citation:
Assignee:
FUJITSU LTD (JP)
KITAJIMA MASAYUKI (JP)
SHONO TADAAKI (JP)
TAKESUE MASAKAZU (JP)
NODA YUTAKA (JP)
KITAJIMA MASAYUKI (JP)
SHONO TADAAKI (JP)
TAKESUE MASAKAZU (JP)
NODA YUTAKA (JP)
International Classes:
B23K35/26; C22C13/00; B23K35/02; H05K3/34; (IPC1-7): B23K35/26
Foreign References:
| JP2002001575A | 2002-01-08 | |||
| JP2001347394A | 2001-12-18 | |||
| JP2000015478A | 2000-01-18 | |||
| EP0976489A1 | 2000-02-02 | |||
| JPH09174278A | 1997-07-08 | |||
| JPH0819892A | 1996-01-23 |
Other References:
See also references of EP 1495830A4
Attorney, Agent or Firm:
Ishida, Takashi (ISHIDA & ASSOCIATES Toranomon 37 Mori
Bldg., 5-1, Toranomon 3-chom, Minato-ku Tokyo, JP)
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