Title:
SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2022/210271
Kind Code:
A1
Abstract:
By containing 0.1-3 mass% Ag, 8-15 mass% Cu and 30-40 mass% Sb, and the remainder being Sn, a solder alloy is provided which, even in high temperature environments, suppresses re-melting of a solder joint that is formed.
Inventors:
NAKANO TAKESHI (JP)
SAKAMOTO ISAO (JP)
NARUSE SHOUICHIROU (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
SAKAMOTO ISAO (JP)
NARUSE SHOUICHIROU (JP)
SHIMADA TOSHIAKI (JP)
OKUBO KOICHI (JP)
Application Number:
PCT/JP2022/014030
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
C22C13/02; B23K35/22; B23K35/26; C22C30/04; H05K3/34
Domestic Patent References:
| WO2014024715A1 | 2014-02-13 | |||
| WO2020122253A1 | 2020-06-18 |
Foreign References:
| JP2018047489A | 2018-03-29 | |||
| KR20200082107A | 2020-07-08 | |||
| JP2004298931A | 2004-10-28 | |||
| JP2005122970A | 2005-05-12 | |||
| JP2005340268A | 2005-12-08 | |||
| JP2004298931A | 2004-10-28 |
Attorney, Agent or Firm:
OTA Yoko (JP)
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