Title:
SOLDER BALL AND ELECTRONIC MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/017398
Kind Code:
A1
Abstract:
Provided are a solder ball having significantly greater drop and impact resistance characteristics, and an electronic member that uses the same. The present invention is a solder ball which contains 0.04-0.2 mass % of Ni, with the remainder being Sn and unavoidable impurities, and in which the content of Cu is not higher than the detection limit in ICP analysis. Due to this configuration, the present invention can provide a solder ball having significantly greater drop and impact resistance characteristics, and an electronic member that uses the same.
Inventors:
TERASHIMA SHINICHI (JP)
ISHIKAWA SHINJI (JP)
SAWAKI NAOYA (JP)
AKASHI KEISUKE (JP)
ISHIKAWA SHINJI (JP)
SAWAKI NAOYA (JP)
AKASHI KEISUKE (JP)
Application Number:
PCT/JP2015/069802
Publication Date:
February 04, 2016
Filing Date:
July 09, 2015
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN MAT CO (JP)
NIPPON MICROMETAL CORP (JP)
NIPPON MICROMETAL CORP (JP)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| JP2005040847A | 2005-02-17 | |||
| JP2002018589A | 2002-01-22 | |||
| JP2004058085A | 2004-02-26 | |||
| JP2010099736A | 2010-05-06 | |||
| JPH01283398A | 1989-11-14 |
Attorney, Agent or Firm:
YOSHIDA TADANORI (JP)
Yoshida Justice (JP)
Yoshida Justice (JP)
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