Title:
SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS THEREON
Document Type and Number:
WIPO Patent Application WO2003085697
Kind Code:
A3
Abstract:
A method of retaining a solder mass (40) to a solder-bearing article (20) is provided and includes the steps of: (a) disposing a length of solder mass over at least some of the plurality of openings (30); and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Inventors:
SEIDLER JACK (US)
ZHITOMIRSKY ALEKSANDR (US)
ZHITOMIRSKY ALEKSANDR (US)
Application Number:
PCT/US2003/010149
Publication Date:
June 10, 2004
Filing Date:
April 01, 2003
Export Citation:
Assignee:
INTERPLEX NAS INC (US)
SEIDLER JACK (US)
ZHITOMIRSKY ALEKSANDR (US)
SEIDLER JACK (US)
ZHITOMIRSKY ALEKSANDR (US)
International Classes:
B23K3/06; H05K3/34; (IPC1-7): H01R4/02
Foreign References:
| US5709574A | 1998-01-20 | |||
| US5688150A | 1997-11-18 | |||
| US6261136B1 | 2001-07-17 | |||
| US6461188B2 | 2002-10-08 | |||
| US6494754B2 | 2002-12-17 |
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