Title:
SOLDER BONDED STRUCTURE, WINDOWPANE FOR VEHICLES, METHOD FOR PRODUCING SOLDER BONDED STRUCTURE, METHOD FOR PRODUCING GLASS ARTICLE, AND GLASS ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/172785
Kind Code:
A1
Abstract:
A solder bonded structure in which a glass plate and a metal component are bonded to each other, and which is sequentially provided with the glass plate, a conductive layer, a metal layer, a solder layer and the metal component in this order. With respect to this solder bonded structure, the conductive layer contains a metal component and a glass component.
Inventors:
KIDOKORO TAKURO (JP)
HAMADA JUN (JP)
HAMADA JUN (JP)
Application Number:
PCT/JP2022/003311
Publication Date:
August 18, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
H01R4/02; B23K1/00; B23K1/19; B60J1/00; C03C27/12; H01Q1/32; H01R43/02
Foreign References:
| JP2008218399A | 2008-09-18 | |||
| JP2016503568A | 2016-02-04 | |||
| JPS60143576A | 1985-07-29 | |||
| JPH03209793A | 1991-09-12 | |||
| JPS60236469A | 1985-11-25 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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