Title:
SOLDER BONDING METHOD FOR MOUNTING COMPONENT AND SOLDER BONDING APPARATUS FOR MOUNTING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/026286
Kind Code:
A1
Abstract:
In the present invention, a circuit pattern including electrodes 21 for mounting a mounting component CP is formed on a flexible substrate 7, a solder paste P is applied to the electrodes 21, and the mounting component CP is mounted on the electrodes 21. A predetermined region 19 where the mounting component CP is mounted is held by a holding table 15 formed of an insulating material, a coil 16 having a shape surrounding the predetermined region 19 is disposed on the rear surface of the predetermined region 19, and the mounting component CP is bonded to the electrodes 21, while inductively heating the electrodes 21 by supplying the coil 16 with a current.
Inventors:
TAJIMA HISAYOSHI (JP)
SUGIYAMA KAZUHIRO (JP)
SUGIYAMA KAZUHIRO (JP)
Application Number:
PCT/JP2016/072056
Publication Date:
February 16, 2017
Filing Date:
July 27, 2016
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
WONDER FUTURE CORP (JP)
WONDER FUTURE CORP (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/002; H01L21/60
Foreign References:
| JP2013197111A | 2013-09-30 | |||
| JP2004186386A | 2004-07-02 | |||
| JP2001044616A | 2001-02-16 | |||
| JP2008141188A | 2008-06-19 | |||
| JP2013171863A | 2013-09-02 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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