Title:
SOLDER-COATED BALL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/141166
Kind Code:
A1
Abstract:
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% to 65 mass%, and the Bi content is high on the inside and low on the outside. Another solder-coated ball (10B) further has a Ni plating layer (13) between the core (11) and the solder layer (12).
Inventors:
ASADA KEN (JP)
NISHIMURA JUNKO (JP)
NISHIMURA JUNKO (JP)
Application Number:
PCT/JP2013/057484
Publication Date:
September 26, 2013
Filing Date:
March 15, 2013
Export Citation:
Assignee:
NEOMAX MATERIALS CO LTD (JP)
HITACHI METALS LTD (JP)
HITACHI METALS LTD (JP)
International Classes:
C25D7/00; B22F1/17; B23K35/14; B23K35/26; C22C12/00; C22C13/02; C25D17/22; H01L21/60
Foreign References:
| JP2007046087A | 2007-02-22 | |||
| JP2005005630A | 2005-01-06 |
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
Seiji Okuda (JP)
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