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Title:
SOLDER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/034083
Kind Code:
A1
Abstract:
Provided is a solder composition containing a flux, a solder alloy, and a silicone oil.

Inventors:
UCHIDA NORIYOSHI (JP)
JANG DUCK SOO (KR)
KIM JU HEUNG (KR)
SEOK HO WON (KR)
Application Number:
PCT/JP2017/025326
Publication Date:
February 22, 2018
Filing Date:
July 11, 2017
Export Citation:
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Assignee:
KOKI KK (JP)
International Classes:
B23K35/363; B23K35/22
Foreign References:
JP2006088205A2006-04-06
JP2012072213A2012-04-12
JPH01113198A1989-05-01
JP2008012576A2008-01-24
JPH0592296A1993-04-16
JPS62199290A1987-09-02
Other References:
See also references of EP 3473373A4
Attorney, Agent or Firm:
IZAWA Makiko (JP)
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