SOLDER, SOLDER CONNECTING METHOD AND ELECTRONIC PART MOUNTED STRUCTURE

Title:

SOLDER, SOLDER CONNECTING METHOD AND ELECTRONIC PART MOUNTED STRUCTURE

Document Type and Number:

WIPO Patent Application WO/1995/028249

Kind Code:

A1

Abstract:

An object of the present invention is to provide solder in which bridges rarely occur. Solder having a solid phase temperature and a liquid phase temperature different from each other is used. Since such solder is not wholly melted immediately after it starts being melted (immediately after it attains the solid phase temperature), the surface tension thereof is apparently low. Therefore, the solder is hard to be moved in the bridge-forming direction (leads-striding direction). In the meantime, the solder wet-spreads over a pad and leads owing to its wet-spreading force even immediately after it starts being melted. Accordingly, the occurrence of bridges can be prevented. Even when solder which has been supplied in advance is already in a bridged state, the bridge-forming solder is separated uniformly as it wet-spreads over leads, so that the bridges disappear.

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Inventors:

YAMAMOTO KENICHI (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
SHIMOKAWA HANAE (JP)
HACHIYA TOSHIHIRO (JP)
TUNEYOSI YOSHIRO (JP)

Application Number:

PCT/JP1995/000742

Publication Date:

October 26, 1995

Filing Date:

April 17, 1995

Export Citation:

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Assignee:

HITACHI LTD (JP)
YAMAMOTO KENICHI (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
SHIMOKAWA HANAE (JP)
HACHIYA TOSHIHIRO (JP)
TUNEYOSI YOSHIRO (JP)

International Classes:

B23K35/26; C22C11/06; C22C13/00; H05K3/34; (IPC1-7): B23K35/26

Other References:

R.J. KLEIN WASSINK, Transl. TADASHI TAKEMOTO et al., "Soldering in Electronics", (30.08.86), NIKKAN KOGYO SHIMBUN, LTD., p. 86-89, 99-100, 103-107, 108, 324-325.
JENNIE S. HWANG, Transl. TORANOSUKE KAWAGUCHI et al., "Solder Paste in Electronics Packaging", (10.01.92), KOGYO CHOSAKAI, p. 86-88, 130.
COMMITTEE FOR COMPILATION OF BRAZING AND SOLDERING HANDBOOK, "Brazing and Soldering", (15.11.67), INDUSTRIAL REPORT, p. 112.

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