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Patent Searching and Data


Title:
SOLDER DELIVERY SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/128967
Kind Code:
A1
Abstract:
With this solder delivery system, when a determination that a solder cup (70) has been placed in a solder delivery apparatus (26), reading of a barcode by a barcode reader (170) is permitted, whereas when a determination that no solder cup has been placed in the solder delivery apparatus, reading of a barcode by the barcode reader is restricted. In so doing, it is possible to carry out a verification procedure only on a solder cup that has been placed in the solder delivery apparatus (26), thus preventing operator mistakes, and making it possible for verification procedures to be carried out on solder containers in an appropriate manner.

Inventors:
KATO MITSUAKI (JP)
FUJITA YOJI (JP)
Application Number:
PCT/JP2014/054700
Publication Date:
September 03, 2015
Filing Date:
February 26, 2014
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B23K3/06; H05K3/34
Foreign References:
JP2011031301A2011-02-17
JP2010172928A2010-08-12
JP2008207392A2008-09-11
JPH11157098A1999-06-15
JP2010158906A2010-07-22
JP2005096126A2005-04-14
JP2004306102A2004-11-04
JP2013123889A2013-06-24
JP2013123890A2013-06-24
JP2003311930A2003-11-06
JP2003117653A2003-04-23
Other References:
See also references of EP 3112071A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
Patent business corporation NeXT (JP)
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